Apparatus and method for storing an electronic component, method for packaging electronic components and method for mounting an electronic component

ABSTRACT

An apparatus for storing an electronic component, the electronic component having a first surface and an opposite second surface, the apparatus includes a first film having a pocket that stores the electronic component and wherein the pocket has a protrusion at a bottom and wherein a top of the protrusion contacts with the second surface of the electronic component, and a second film covering the pocket and wherein a part of the second film is stuck to the first surface of the electronic component by a pressure difference so that the electronic component does not move freely.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates, in general, to an apparatus and methodfor storing an electronic component, a method for packaging electroniccomponents and a method for mounting an electronic component and, moreparticularly, to a tape carrier package.

This is a counterpart of and claims priority to Japanese patentapplication Serial Number 152602/2002, filed on May 27, 2002, thesubject matter of which is incorporated herein by reference.

2. Description of the Related Art

A conventional apparatus for storing an electronic component, inparticular to be able to be winded onto a reel, is called an embossedcarrier type tape. The conventional embossed carrier tape comprises anembossed carrier tape having a plurality of pockets in series, andwherein each pocket stores the electronic component, and a cover tapecovering the first tape. The conventional embossed carrier type tape iswinded onto the reel, and is carried to somewhere as it is. When theelectronic components are mounted on a substrate, firstly the cover tapeis peeled away from the embossed carrier tape, secondly the storedelectronic components are extracted from the pockets of the embossedcarrier tape, and finally the extracted electronic components aremounted on the substrate.

However, the electronic components which are stored in the conventionalembossed carrier type tape freely move in the pockets due to shock orvibration during carrying. Therefore, terminals of the electroniccomponents which are stored in the conventional embossed carrier typetaping may be bent.

SUMMARY OF THE INVENTION

According to one aspect of the present invention, there is provided anapparatus for storing an electronic component, the electronic componenthaving a first surface and an opposite second surface, the apparatusincludes a first film having a pocket that stores the electroniccomponent and wherein the pocket has a protrusion at a bottom andwherein a top of the protrusion contacts with the second surface of theelectronic component, and a second film covering the pocket and whereina part of the second film is stuck to the first surface of theelectronic component by a pressure difference so that the electroniccomponent does not move freely. The novel features of the invention willmore fully appear from the following detailed description, appendedclaims and the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1(a)-1(c) are a top plan view and respective cross sectional viewsof an apparatus for storing an electronic component, according to afirst preferred embodiment of the present invention.

FIG. 2 is a cross sectional view of an apparatus for storing anelectronic component according to a second preferred embodiment of thepresent invention.

FIG. 3 is a top plan view of an apparatus for storing an electroniccomponent according to a third preferred embodiment of the presentinvention.

FIG. 4 is a perspective view of a reel including the apparatus forstoring electronic components is winded thereon, according to a fourthpreferred embodiment of the present invention.

FIG. 5 is a perspective view of a bag including the reel stored thereinapparatus according to the fourth preferred embodiment of the presentinvention.

FIG. 6(a)-6(b) are cross sectional views for explaining mounting of anelectronic component according to a fifth preferred embodiment of thepresent invention.

FIGS. 7(a)-7(b) are top plain views of an apparatus according to a sixthpreferred embodiment of the present invention.

FIGS. 8(a)-8(b) are cross sectional views for explaining storing of anelectronic component according to the sixth preferred embodiment of thepresent invention.

FIG. 9 is a perspective view of a decompression chamber according to thesixth preferred embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The preferred embodiments of the present invention will be described.However, the invention is not limited to the specific embodiments.Moreover, not all the combinations of the characteristics of the presentinvention described in the embodiments are essential to the presentinvention.

An apparatus for storing an electronic component according to a firstpreferred embodiment of the present invention will be described withreference to FIGS. 1(a)-1(c). FIG. 1(a) is a top plan view of theapparatus according to the first preferred embodiment of the presentinvention. FIG. 1(b) is a cross sectional view taken on line 1-1 of FIG.1(a). Also, FIG. 1(c) is a cross sectional view taken on line 1-1 ofFIG. 1(a).

The apparatus for storing an electronic component 130 according to thefirst preferred embodiment of the present invention comprises a firstfilm 100 and a second film 110. Generally, the apparatus is called anembossed carrier type tape. Also, the first film 100 is called anembossed carrier tape, and the second film 110 is called a cover tape.By the way, the electronic component 130 has a first surface 130 a andan opposite second surface 130 b. Also, the electronic component 130 hasa plurality of terminals 131 which are used for connecting to asubstrate.

The first film 100 of the apparatus has a plurality of pockets 101 inseries. Each pocket 101 stores a respective electronic component 130.Each pocket 101 has a protrusion 103 at a bottom 102, wherein a top 104of the protrusion 103 contacts with the second surface 130 b of theelectronic component 130. The second film 110 covers the pocket 101 ofthe first film 100, wherein a part 110 a of the second film 110 is stuckto the first surface 130 a of the electronic component 130 by a pressuredifference, so that the electronic component 130 does not move freely.

The apparatus has a flexibility so as to be windable onto a reel.Generally, an organic substance or a paper may be used as materials ofthe apparatus. The apparatus made of an organic substance provideairtight pockets that are resistant to dampness. Needless to say theapparatus made of paper also can be effective if the paper is capable ofmaking pockets of high airtightness that are resistant to dampness. Inthis preferred embodiment of the present invention, the material of thefirst film 100 may be polyvinyl chloride (PVC), polystyrene (PS),polyethylene terephthalate (PET), or polycarbonate (PC), or the like.The material of the second film 110 is polyethylene (PE), polyethyleneterephthalate (PET), or polystyrene (PS), or the like.

As shown in FIG. 1(c), in order to ensure that the first surface 130 aof the electronic component 130 and the second film 110 stick togetherwell, it is desirable that the electronic component 130 does notextremely protrude from the pocket 101. However, even though theelectronic component 130 protrudes from the pocket 101, it is not worthconsidering if the electronic component 130 does not move freely.

The pocket 101 of the first film 100 is covered with the second film110. The pocket 101 has one horizontal bottom 102 and a vertical sidewall, wherein the side wall is provided on the bottom 102. Theelectronic component 130 is stored in an internal space of the pocket101 which is made by the bottom 102, the side wall and the second film110. In this preferred embodiment of the present invention, the pressureof the internal space of the pocket 101 is lower than that outside ofthe internal space. Therefore, a part of the second film 110 is stuck tothe first surface 130 a of the electronic component 130 by thispressure, difference so that the electronic component 130 does not movefreely in the pocket 101, if the apparatus is subjected to shock fromoutside of the apparatus. Not to move freely means that the electroniccomponent 130 does not move to such an extent that insomuch terminal 131of the electronic component 130 would become bent.

In the apparatus for storing the electronic component according to thefirst preferred embodiment of the present invention, the first surfaceof the electronic component is stuck to the second film by pressuredifference. The electronic component is tightly fixed by the second filmand the protrusion of the bottom of the first film. The electroniccomponent does not move freely in the apparatus if the apparatusexperiences shock from outside of the apparatus. Therefore, theapparatus for storing the electronic component according to the firstpreferred embodiment of the present invention avoids bending of theterminals of the electronic component during carrying.

An apparatus for storing an electronic component according to a secondpreferred embodiment of the present invention will be described withreference to FIG. 2. FIG. 2 is a cross sectional view of the apparatusaccording to the second preferred embodiment of the present invention.Also, FIG. 2 is the cross sectional view taken on line 1-1 of FIG. 1(a).

The apparatus for storing the electronic component 130 according to thesecond preferred embodiment of the present invention comprises a firstfilm 200, the second film 110 and a third film 210. The first film 200of the apparatus has a plurality of pockets 201 in series. Each pocket201 stores a respective electronic component 130. The pocket 201 has twoprotrusions 203 at a bottom 202, wherein the tops 203 a of eachprotrusion 203 contacts with the second surface 130 b of the electroniccomponent 130. Also, the first film 200 has a through hole 204 at thebottom 202 between two protrusions 203. The through hole 204 is used forautomatic detection of presence of the electronic component 130 in thepocket 201. So, it is desirable that the through hole 204 is provided atthe bottom 202 right under the electronic component 130. The third film210 covers the through hole 204 from beneath the first film 200.Accordingly, the first film 200 including the electronic component 130between the second film 110 and the third film 210.

The third film 210 also has a necessary flexibility to be winded onto areel. In this preferred embodiment of the present invention, thematerial of the third film 210 may be polyethylene (PE), orpolypropylene (PP), or the like.

In the apparatus for storing the electronic component according to thesecond preferred embodiment of the present invention, if the first filmhas a through hole, this invention is adapted without drastic changes.Therefore, the apparatus for storing the electronic component accordingto the second preferred embodiment of the present invention prevents asharp rise of cost.

An apparatus for storing an electronic component according to a thirdpreferred embodiment of the present invention will be described withreference to FIG. 3. FIG. 3 is a top plan view of the apparatusaccording to the third preferred embodiment of the present invention.

The apparatus for storing the electronic component 130 according to thethird preferred embodiment of the present invention comprises the firstfilm 100 and the second film 110 as in the first preferred embodiment,and also includes a fourth film 300.

The fourth film 300 is bigger than the second film 110, and covers thesecond film 110. The apparatus is thus provided with a flexibility to bewinded onto a reel. In this preferred embodiment of the presentinvention, the material of the fourth film 300 is polyethylene (PE),polyethylene terephthalate (PET), or polystyrene (PS), or the like.

In the apparatus for storing the electronic component according to thethird preferred embodiment of the present invention, the fourth film 300covers a joint between the first film 100 and the second film 110. Theapparatus for storing the electronic component according to the thirdpreferred embodiment of the present invention prevents the joint betweenthe first and second films from leaking for a long time. Therefore, theapparatus for storing the electronic component according to the thirdpreferred embodiment of the present invention prevents the terminal ofthe electronic component from being bent during carrying.

In addition, when a part of the fourth film sticks to a part of thesecond film, the second film is peeled away from the first filmsimultaneously when peeling away the fourth film from the first film.Therefore, the apparatus for storing the electronic component accordingto the third preferred embodiment of the present invention improvesworking efficiency.

A method for packing electronic components according to a fourthpreferred embodiment of the present invention will be described withreference to FIGS. 4 and 5. FIG. 4 is a perspective view of a reel thatthe apparatus for storing electronic components is winded on accordingto the fourth preferred embodiment of the present invention. FIG. 5 is aperspective view of a bag in which the reel with the apparatus forstoring electronic components winded thereon is stored, according to thefourth preferred embodiment of the present invention.

The electronic components are stored in an apparatus which is describedin any of the first, second and third preferred embodiments. In a methodfor packaging the electronic components each having a first surface andan opposite second surface, first, an apparatus for storing theelectronic components is prepared. The apparatus comprises a first filmhaving a plurality of pockets in series that store the electroniccomponents, wherein each pocket has a protrusion at a bottom, wherein atop of each protrusion contacts with the second surface of a respectiveelectronic component; and a second film covering the pockets, whereinparts of the second film a re stuck to the first surface of theelectronic components by a pressure difference, so that the electroniccomponents will not move freely. Second, a reel 400 is provided, andthen, the apparatus is winded onto the reel 400. In addition, the reel400 is placed into a bag 500 to be protected against dampness or staticelectricity. For example, the bag 500 is made of aluminum-laminate. Ifnecessary, a desiccant 510 is provided in the bag 500. The reel 400allows for compact storage of the apparatus, so that the apparatus maybe carried easily.

According to the method for packing electronic components according tothe fourth preferred embodiment of the present invention, the apparatusis protected against dampness and static electricity. Therefore, themethod for packing electronic components according to the fourthpreferred embodiment of the present invention causes reliability of theelectronic components to improve.

A method for packing electronic components according to a fifthpreferred embodiment of the present invention will be described withreference to FIGS. 6(a) and 6(b). FIGS. 6(a)-6(b) are cross sectionalviews for explaining mounting of an electronic component according tothe fifth preferred embodiment of the present invention.

The apparatus carried by the method mentioned in the above preferredfourth embodiment, is taken out from the bag 500. In the method formounting an electronic component 130 having a first surface and anopposite second surface on a substrate, first, an apparatus for storingthe electronic component 130 is prepared. The apparatus comprises afirst film 100 having a plurality of pockets 101, where each pocketstores a respective electronic component 130, wherein each pocket 101has a protrusion at a bottom, wherein a top of the protrusion contactswith the second surface of a respective electronic component 130; and asecond film 110 covering the pockets 101, wherein parts of the secondfilm 110 are stuck to the first surface of the respective electroniccomponents 130 by a pressure difference, so that the electroniccomponents 130 do not move freely. Next, the second film 110 is peeledaway from the first film 100. Next, the electronic component 130 isextracted from the pocket 101, and then, the extracted electroniccomponent 130 is mounted on the substrate 600 with solder materials.

In the method for packing electronic components according to the fifthpreferred embodiment of the present invention, the apparatus preventsthe electronic components from being exposed to dampness and staticelectricity, to thereby prevent cracks from forming in the electroniccomponents. Therefore, the method for packing electronic componentsaccording to the fifth preferred embodiment of the present inventioncauses reliability of the electronic components to improve.

When the apparatus is as described in the second preferred embodiment,the third film 210 is peeled away from the first film 100 before thesecond film 110 is peeled away. Therefore, the through hole 204 isexposed, and then the electronic components 130 is detected using thethrough hole 204.

When the apparatus is as described in the third preferred embodiment,the second film 110 is peeled away from the first film 100simultaneously when peeling away the fourth film 300 from the first film100. Therefore, the apparatus for storing the electronic componentaccording to the fifth preferred embodiment of the present inventionimproves working efficiency.

A method for storing an electronic component according to a sixthpreferred embodiment of the present invention will be described withreference to FIGS. 7-9. FIGS. 7(a)-7(b) are top plain views of anapparatus according to the sixth preferred embodiment of the presentinvention. FIGS. 8(a)-8(b) are cross sectional views for explainingstoring of the electronic component according to the sixth preferredembodiment of the present invention, taken on line 8-8 of FIG. 7(a).FIG. 9 is a perspective view of a decompression chamber according to thesixth preferred embodiment of the present invention.

In the method for storing an electronic component, first, the electroniccomponents 130 having a first surface and an opposite second surface areprovided. Next, the first film 100 having a plurality of pockets 101 inseries is prepared. Each pocket 101 stores a respective electroniccomponent 130, and has a protrusion at a bottom. Next, respectiveelectronic components 130 are placed into each of pockets 101 of thefirst film 100, wherein a top of the protrusions contact with the secondsurface of the respective electronic components 130. Next, a second film110 covers over the pockets 101. Next, the second film 110 is adhered tothe edge of the first film 100 such as at the rightmost portion of FIG.8(a) by heat or glue to cover pockets 101, wherein first portions of thesecond film 110 are not adhered to the edges between the pockets 101.Therefore, the adjoining pockets have an opening 800 by which air freelycomes and goes in the adjoining pockets. Also, a second portion of thesecond film 110 is not adhered to the long sides 700 of the first film100 of FIG. 7(a). The second film 110 is a rectangle, and the secondportion of that is formed at the long sides of the rectangle. Next, gasis removed from the pockets 101 from the second portion of the secondfilm 110 in decompression chamber 900 as illustrated in FIG. 9, so thatparts of the second film 110 contact the first surfaces of theelectronic components 130, as illustrated in FIG. 8(b). Then, the secondportion of the second film 110 is also adhered to the first film 100 byheat or glue.

In the method for storing an electronic component according to the sixthpreferred embodiment of the present invention, the first surface of theelectronic component is stuck to the second film by a pressuredifference. The electronic component is tightly fixed by the second filmand the protrusion of the bottom of the first film. The electroniccomponent does not move freely in the apparatus if the apparatus issubject to extend shock. Therefore, the apparatus using the method ofthe sixth preferred embodiment of the present invention prevents theterminals of the electronic component from being bent during carrying.It should be understood that the second portion 810 may be located atany position along the periphery of the apparatus along the edge of thefirst film 100.

By the way, it is possible that the second portion of the second film110 informed at the short sides of the rectangular-shaped films forexample. It is useful for the case that the first and second films 100and 110 are adhered to each other while they are winded onto the reel400 in FIG. 4. In this case, it is not necessary to stop winding.

Furthermore, a method for removing gas from the pocket will be describedin detail with reference to FIG. 9. First, the first film 100 having theelectronic components 130 stored in the pockets 101 and being coveredwith the second film 110 (thereafter an apparatus), is placed into adecompression chamber 900 shown in FIG. 9. Next, pressure of thedecompression chamber 900 is reduced. And then, gas is removed from thepockets 101 at the second portion of the second film 110. When pressureof the decompression chamber 900 is reduced, pressure of the pockets 101is higher than that of decompression chamber 900. So, gas in the pockets101 moves to outside of the pockets 101. Therefore, pressure of thepockets 101 is reduced.

When the apparatus is taken out from the decompression chamber 900,pressure of the pockets 101 is lower than that of outside of it.Therefore, there are no large openings at the first and second portionsof the second film 110. As a result, an amount of gas which enters thepockets 101 through the first and second portions of the second film 110is small. Immediately after the apparatus is taken out from thedecompression chamber 900, the second portion of the second film 110 isadhered to the pocket 101 by heat or glue. Therefore, the electroniccomponents 130 are fixed enough, so that they do not move freely.Thereby, an amount of pressure of the decompression chamber 900 dependson pressure external of the decompression chamber 900. In other words,it is enough that pressure of the decompression chamber 900 is reducedto such an extent that the apparatus is fixed when it is taken-out fromthe decompression chamber 900. In the method for removing gas from thepocket, by just reducing pressure of the decompression chamber 900, gaswithin the pockets is removed easily.

While the preferred form of the present invention has been described, itis to be understood that modifications will be apparent to those skilledin the art without departing from the spirit of the invention.

The scope of the invention, therefore, is to be determined solely by thefollowing claims.

1-4. (canceled)
 5. A method for packaging electronic components having afirst surface and an opposite second surface, the method comprising:preparing an apparatus for storing the electronic components, whereinthe apparatus comprises a first film having a plurality of pockets inseries that store the electronic components, and wherein each pocket hasa protrusion at a bottom, and wherein a top of each protrusion contactswith the second surface of a respective electronic component, and asecond film covering the pockets, and wherein parts of the second filmare stuck to the first surface of the electronic components by apressure difference, so that the electronic components do not movefreely; providing a reel; and winding the apparatus onto the reel. 6.The method according to claim 5, further comprising placing said reelinto a bag to protect the electronic components from dampness or staticelectricity.
 7. The method according to claim 6, wherein said first andsecond films are made of an organic substance.
 8. The method accordingto claim 5, wherein the bottoms of said pockets of said first film eachhave a through hole, and wherein the apparatus further comprises a thirdfilm covering the through holes.
 9. The method according to claim 5,wherein the apparatus further comprises a third film covering saidsecond film. 10-18. (canceled).